- high-density electronic packaging
- Engineering: HDEP
Универсальный русско-английский словарь. Академик.ру. 2011.
Универсальный русско-английский словарь. Академик.ру. 2011.
Memory storage density — is a measure of the quantity of information bits that can be stored on a given length of track, area of surface, or in a given volume of a computer storage medium. Generally, higher density is more desirable, for it allows greater volumes of data … Wikipedia
Test probe — Typical passive oscilloscope probe being used for testing an integrated circuit. A test probe (test lead, test prod, or scope probe) is a physical device used to connect electronic test equipment to the device under test (DUT). They range from… … Wikipedia
Teradyne — Infobox Company company name = Teradyne company company type = Public (nyse|TER) company slogan = Because Testing Matters foundation = 1960 contact = [1 978 370 2700] location = North Reading, Massachusetts Founders = Alex d’Arbeloff, Nick DeWolf … Wikipedia
Amphenol — Corporation (NYSE|APH) is a major producer of electronic and fiber optic connectors, cable and interconnect systems. Amphenol is a portmanteau from the corporation s original name, American Phenolic Corp. Amphenol was founded in Chicago in 1932… … Wikipedia
Business and Industry Review — ▪ 1999 Introduction Overview Annual Average Rates of Growth of Manufacturing Output, 1980 97, Table Pattern of Output, 1994 97, Table Index Numbers of Production, Employment, and Productivity in Manufacturing Industries, Table (For Annual… … Universalium
Three-dimensional integrated circuit — In electronics, a three dimensional integrated circuit (3D IC, 3D IC, or 3 D IC) is a chip in which two or more layers of active electronic components are integrated both vertically and horizontally into a single circuit. The semiconductor… … Wikipedia
materials science — the study of the characteristics and uses of various materials, as glass, plastics, and metals. [1960 65] * * * Study of the properties of solid materials and how those properties are determined by the material s composition and structure, both… … Universalium
Mathematics and Physical Sciences — ▪ 2003 Introduction Mathematics Mathematics in 2002 was marked by two discoveries in number theory. The first may have practical implications; the second satisfied a 150 year old curiosity. Computer scientist Manindra Agrawal of the… … Universalium
Printed circuit board — Part of a 1983 Sinclair ZX Spectrum computer board; a populated PCB, showing the conductive traces, vias (the through hole paths to the other surface), and some mounted electrical components A printed circuit board, or PCB, is used to… … Wikipedia
Thermal copper pillar bump — The Thermal Copper Pillar Bump, also known as the thermal bump , is a thermoelectric device made from thin film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and… … Wikipedia
Glossary of environmental science — This is a glossary of environmental science.Environmental science is the study of interactions among physical, chemical, and biological components of the environment. Environmental science provides an integrated, quantitative, and… … Wikipedia